PCB Capability

Line width/Line spacing 3/3mils
Number of Layers count up to 42 Layers
Multilayer Materials FR4 Tg135/170, Rogers, Anti-CAF, Halogen-free
Single layer Materials FR1, FR2, CEM-1
Copper Thickness 0.5oz ~6oz
Layer to Layer Registration +/- 4 mils ( 0.1mm )
Min SMT Pitch 6 mils ( 0.2mm )
Impedance Control +/- 5% ~ +/- 10%
Min. Mechanical Drill Hole Diameter 8 mils ( 0.2mm )
Min. Laser Drill Hole Diameter 3 mils ( 0.075mm )
Finish Board thickness 0.5mm ~ 10mm
Hole to Hole Tolerance +/- 2mils ( 0.05mm )
Hole to Edge Tolerance +/- 4 mils ( 0.1mm )
Max. Aspect Ratio 16 : 1
Solder mask Liquid-imageable and conventional UV cure
Surface Finishing ( Rohs compliance )

Leadfree HASL, OSP, ENIG, Immersion Tin/Silver,  Electrolytic Gold

Inspection Automatic Optical Inspection
 
  • Open/Short testing
  • Double sided SMD of 0.012 pitch
  • Flying Probe
1K/10K Clean room Artwork plotting, Wet/Dry film, Lamination
Artwork generation CAM work station / Laser plotter
Data transfer Dedicated FTP server / E-mail
Other Special Features Buried via, Blind via, HDI, Backdrill, Heatsink..etc
1K/10K Clean room Artwork plotting, Wet/Dry film, Lamination
Artwork generation CAM work station / Laser plotter
Data transfer Dedicated FTP server / E-mail
Other Special Features Buried via, Blind via, HDI, Backdrill, Heatsink..etc
 

Quick-Turn PCB Capabilities

Line width/Line spacing 3/3mils
Number of Layers count up to 24 Layers
Materials

FR4 135/170, Rogers, Anti-CAF High Freq., Halogen-free

Copper Thickness 0.5oz ~ 13oz
Impedance Control +/- 5% ~ +/- 10%
Min. Mechanical Drill Hole Diameter 8 mils ( 0.2mm )
Finish Board thickness 0.2mm ~ 8mm
Max. Aspect Ratio 12 : 1
Surface Finishing ( Rohs compliance )

Leadfree HASL, OSP, ENIG, Immersion Tin/Silver, Electrolytic Gold

Production Leadtime Up to 2 working days
( Depending on actual PCB specified requirement )
Data transfer Dedicated FTP server / E-mail