Rigid Printed Circuit Boards Fabrication Singapore & Malaysia - Vital Links

Heat-sink

Cew Developer — Wed, 05 Oct 2022 07:49:07 +0000

Heat-sink structure: Post-bonding, Pre-bonding, Sweat-soldering, Conductive adhesive, Press-fit

Cew Developer — Wed, 05 Oct 2022 07:48:49 +0000

Radio frequency Microstrip precision

Line Width: +/-0.5mil

Line Length: +/-1.2mil

Cew Developer — Wed, 05 Oct 2022 07:48:35 +0000

– From 0.5oz – 6oz for masspro build

– Up to 30oz for sample build

Cew Developer — Wed, 05 Oct 2022 07:48:22 +0000

Cew Developer — Wed, 05 Oct 2022 07:47:16 +0000

Layer: Up to 36 layers

Width/Space (Outer layer): 3mil/3mil

Width/Space (Inner layer): 2.2mil/2.2mil

Aspect Ratio(0.15mmFinish Hole): 22:1

Aspect Ratio(0.20mmFinish Hole): 25:1

Impedance tolerance: +/- 5%

Cew Developer — Wed, 05 Oct 2022 07:37:13 +0000

Structure: Any layer (16)

Width/Space (Outer layer): 30/30um

BGA pitch: 0.30mm

Cew Developer — Wed, 05 Oct 2022 07:36:09 +0000